Batch type sputtering + plasma polymerization system

Features

This is a composite thin-film deposition system that integrates a batch-type sputtering system and a plasma polymerization system. It can continuously process highly uniform film deposition as a PVD sputtering system and polymer film deposition.

Utilizing magnetron sputtering technology, we can reliably form metal thin films, oxide films, and nitride films.
The newly developed plasma polymerization method enables surface functionalization, hydrophilization treatment, antifouling coating, and water-repellent coating through high-speed polymerization.
Leveraging the technological philosophies of RF and DC sputtering systems, we achieve both high-quality film thickness control and high productivity.
It can handle flexible substrates and deposit films on complex shapes, making it suitable as a research and development system for developing high-performance coatings.

Specifications

Model	VRSP750AD
Substrate size (Including jigs, etc.)	φ600×1,500mm 1 axis
Spatter target (examples)	Aluminum (Al), Titanium (Ti), Chromium (Cr), etc.
Polymerization monomers (examples)	HMDSO (Hexamethyldisiloxane), etc.

Main use

Formation of reflective films, transparent conductive films, and surface protective films for automotive lamp reflectors.
Formation of reflective films and antifouling coatings by highly uniform film deposition on cosmetic containers and mirror components.
Future applications are expected to include functional thin film formation fields such as ITO film deposition, optical film sputtering, electrode film deposition, insulating film deposition, ceramic film deposition, and piezoelectric film deposition.
For research and development purposes, it is expected to be applied to the development of advanced materials using yttria (Y₂O₃), yttrium-based materials, and various reactive sputtering processes.